Lattice Expands mVision Solution Stack With New Image Processing, Bridging Capabilities

Lattice Semiconductor (NASDAQ:LSCC), the low power programmable leader, today announced updates to the Lattice mVision™ Solution Stack with expanded capabilities that deliver flexible interface bridging and

Lattice Semiconductor (NASDAQ:LSCC), the low power programmable leader, today announced updates to the Lattice mVision™ Solution Stack with expanded capabilities that deliver flexible interface bridging and higher quality image signal processing (ISP) performance. Lattice also introduced new hardware boards based on the latest Lattice Nexus™ platform that help accelerate the development of low power embedded vision applications including Machine Vision, Robotics, ADAS, Video Surveillance, and Drones.

The latest release of the Lattice mVision Solution Stack (v 3.0) provides increased interface bridging support for higher precision, better accuracy, and improved flexibility across a broader range of Embedded Vision applications. Highlights of the latest release include:

  • SLVS-EC to MIPI bridging
  • MIPI CSI-2 to LVDS bridging with expanded support for RAW14
  • SubLVDS to MIPI CSI-2 bridging with expanded support for RAW14
  • MIPI to PCIe Bridging

The new development platforms supporting Lattice CertusPro™-NX FPGAs for the latest Embedded Vision applications include the CertusPro-NX Versa Board and Trenz TEL003 PCIe board. They are expected to be available in 1H 2022.

For more information about the Lattice technologies mentioned above, please visit:

  • Lattice mVision Solutions Stack
  • Lattice Nexus Platform
    • Lattice CertusPro-NX
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