- Applied Materials Inc (NASDAQ:AMAT) showcased a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
- Applied Materials developed a new materials engineering solution called the Endura Copper Barrier Seed IMS by combining seven different process technologies in one system under a high vacuum.
- It eliminated the high-resistivity barrier via the interface.
- The solution included copper reflow technology that enabled void-free gap fill in narrow features.
- It helped to reduce electrical resistance at the via contact interface by up to 50%.
- It improved chip performance and power consumption and enabled logic scaling to continue to 3nm and beyond.
- Price action: AMAT shares traded higher by 0.25% at $138.99 in the market session on the last check Wednesday.
Jacobs Awarded $6.4B Contract for US DoE’s Idaho Cleanup Project
Jacobs (NYSE: J) was awarded the Idaho Cleanup Project (ICP) at the Idaho National Laboratory (INL), as the majority partner in the Idaho Environmental Coalition LLC (IEC), which includes members from Jacobs and North Wind Portage Inc. Jacobs has supported the U.S.
