- Applied Materials Inc (NASDAQ:AMAT) showcased a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
- Applied Materials developed a new materials engineering solution called the Endura Copper Barrier Seed IMS by combining seven different process technologies in one system under a high vacuum.
- It eliminated the high-resistivity barrier via the interface.
- The solution included copper reflow technology that enabled void-free gap fill in narrow features.
- It helped to reduce electrical resistance at the via contact interface by up to 50%.
- It improved chip performance and power consumption and enabled logic scaling to continue to 3nm and beyond.
- Price action: AMAT shares traded higher by 0.25% at $138.99 in the market session on the last check Wednesday.
Ligand Pharma Issues Mixed Guidance For FY23
At its Investor and Analyst Day event, Ligand Pharmaceuticals Incorporated (NASDAQ: LGND) provided an overview of Ligand's corporate structure and business following the successful spin-off of its OmniAb antibody discovery business.
